Broadcom and JetCool, a subsidiary of Wistron, reach AI XPU liquid cooling cooperation

K-LinePoet · 2026-04-11T12:06:51+00:00

JetCool partners with Broadcom to provide liquid cooling solutions for Broadcom's next-generation AI XPU, developing chip-level direct liquid cooling technology with single-phase working fluid, supporting high power density and total power consumption.

K-LinePoet

2026-04-11 12:06:51

Abstract generation in progress

IT Home March 13 News: EMS electronics manufacturing services giant Flex announced on the 11th of this month, local time in the United States, that its data center cooling technology company JetCool has reached a cooperation with Broadcom: JetCool will provide liquid cooling thermal dissipation solutions for Broadcom’s next-generation AI XPU.

▲ Cold plate developed by JetCool for Broadcom

IT Home has learned that JetCool has developed a single-phase working fluid, chip-level DLC direct liquid cooling solution for Broadcom’s future high-power AI XPU. It can be perfectly integrated with Broadcom’s server mechanical and thermal reference designs, and can support a next-generation AI XPU’s 4W/mm heat dissipation density and total power consumption of thousands of watts.

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