Xianfeng Precision plans to issue convertible bonds to raise 750 million yuan to advance the layout of advanced semiconductor process projects

NightAirdropper · 2026-03-04T04:31:37+00:00

Xianfeng Precision Science and Technology (688605.SH) plans to raise no more than 750 million yuan through the issuance of convertible bonds, mainly for key projects in the semiconductor field to enhance technological advantages and market position. The funds will be used for the expansion of metal components, research and development of non-metallic materials, development of ceramic electrostatic chucks, and working capital supplementation, aiming to address capacity bottlenecks, meet the demand for high-performance products, and further promote the development of the domestic semiconductor industry chain.

NightAirdropper

2026-03-04 04:31:37

Abstract generation in progress

Xianfeng Precision Technology (688605.SH) recently announced that it plans to raise funds through the issuance of convertible bonds, with a total amount not exceeding 750 million yuan. The funds will mainly be used to advance several key projects in the semiconductor field to further strengthen the company’s technological advantages and market position within the industry.

According to the announcement, the raised funds will focus on four areas: the expansion of core metal device processes for advanced semiconductor manufacturing, the development and production of non-metallic materials and devices for core processes in advanced semiconductor manufacturing, the research and development of ceramic electrostatic chucks for semiconductor equipment, and supplementing the company’s daily operating capital. The implementation of these projects aims to address current capacity bottlenecks and meet downstream customer demands for high-performance semiconductor products.

Management stated that this fundraising project will significantly enhance the company’s R&D and production capabilities in the field of advanced semiconductor processes. By expanding metal device production lines, establishing new R&D bases for non-metallic materials and devices, and increasing investment in key equipment such as ceramic electrostatic chucks, the company is expected to achieve technological breakthroughs and further narrow the gap with leading international firms.

Industry analysts believe that as global competition in the semiconductor industry intensifies, domestic companies are increasing R&D investment and capacity expansion to boost market competitiveness. Xianfeng Precision Technology’s fundraising plan not only supports its own business expansion but also provides strong support for the improvement of the domestic semiconductor supply chain.

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