Keysight Unveils 3D Interconnect Designer for Chiplet and 3DIC Advanced Package Designs

NodeGuardian · 2026-03-01T02:55:18+00:00

Keysight Technologies has introduced the 3D Interconnect Designer, enhancing its EDA portfolio to simplify complex 3D designs for chiplet and 3DIC packages, improving design efficiency and compliance in AI and data center applications.

NodeGuardian

2026-03-01 02:55:18

Abstract generation in progress

Keysight Technologies has launched 3D Interconnect Designer, a new addition to its Electronic Design Automation (EDA) portfolio to address the increasing complexity of 3D interconnect designs for chiplet and 3DIC advanced packages. This tool streamlines the design and optimization process, minimizing errors and accelerating time-to-market for products in AI infrastructure and data center applications. It integrates with existing EDA workflows and supports open industry standards, offering precise electrical analysis and reducing compliance risks.

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