Kunlun Core Technology's STAR Market listing counseling record; Hong Kong stock listing continues to advance

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Caixin.com Baidu spins off chip company Kunlun Chip for Hong Kong listing. Simultaneously “supporting” the Sci-Tech Innovation Board listing filing. On May 8, Beijing Securities Regulatory Bureau announced that Kunlun Chip signed an IPO guidance agreement with China International Capital Corporation Limited on April 29, 2026, and officially completed the Sci-Tech Innovation Board listing guidance filing registration on May 7. The guidance period is expected to cover the second half of 2026, and subsequent steps will follow regulatory requirements to complete guidance acceptance and submit formal IPO application materials.

Caixin learned from market sources that Kunlun Chip is currently still actively promoting its Hong Kong stock listing process. The early layout of A-share guidance filing is to retain flexibility for future domestic financing and also reflects confidence in the domestic capital market.

It is worth noting that previously, tech companies such as Zhipu AI (02513.HK), Biran Technology (06082.HK), and others had promoted A-share guidance filings before and after listing in Hong Kong.

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